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RF and Specialty Components

Terminations - Chip

TTM's chip terminations line is ideal for applications that demand high power capability. Our chip termination devices provide high power dissipation when mounted to an appropriate heat sink. Chip devices from TTM Technologies are manufactured using a thick film process. Our chip terminations feature a high power capability of up to 500 watts, a maximum operating temperature of 200° Celsius (392° F), and a resistor value of 50 Ω. TTM's chip termination products are RoHS compliant and lead-free. Our terminations offer improved VSWR and power handling and are suited for the most demanding applications.

TTM’s Chip Terminations Products

Part Number Order Documents Frequency Power Size Return Loss Resistor Value Material Finish Sample Request
GHz W In dB Ω

060120A25X50-2

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0 - 6.0

10

0.12 x 0.06 x 0.02

19

50

Alumina

Matte Tin over Nickel

A100N50X4A Buy 0 - 3.5 100 0.250 x 0.225 x 0.04 24 50 ALN Matte Tin over Nickel

A125N50X4

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0 - 4.0

125

0.25 x 0.25 x 0.04

22

50

AlN

Matte Tin over Nickel

A150N50X4B

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0 - 2.7

150

0.375 x 0.250 x 0.04

20

50

AlN

Matte Tin over Nickel

A150N50X4C

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0 - 3.0

150

0.35 x 0.23 x 0.04

26

50

AlN

Matte Tin over Nickel

A150N50X4E

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0 - 3.0

150

0.25 x 0.25 x 0.04

20

50

AlN

Matte Tin over Nickel

A15N50X4

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0 - 4.5

15

0.10 x 0.05 x 0.02

20

50

AlN

Matte Tin over Nickel

A16A50X4

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0 - 4.0

16

0.20 x 0.10 x 0.02

20

50

Alumina

Matte Tin over Nickel

A200N50X4

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0 - 2.2

200

0.375 x 0.250 x 0.04

20

50

AlN

Matte Tin over Nickel

A250N50X4

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0 - 2.2

250

0.375 x 0.375 x 0.04

20

50

AlN

Matte Tin over Nickel

A500N50X4

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0 - 1.7

500

0.50 x 0.50 x 0.04

20

50

AlN

Matte Tin over Nickel

XMWT80L1G Buy
DC – 81 0.5 0.06 x 0.03 x 0.013 12 50 ALN Immersion Tin over Nickel
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Terminations - Flanged
Flanged terminators are high-power, mountable devices that are suitable for the most demanding applications.
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Terminations - Flangeless
Our flangeless terminators are designed for the best possible heat transfer as a result of being soldered directly to the heat sink.


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Our terminations feature high frequency and high stability in a small, compact design.



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Related Resources

Application Note
Power Handling Considerations for SMD Terminations, Attenuators, and Resistors
Application Note
Recommended Soldering Techniques
Application Note
Thermal Power Testing Methodology for Chip, Flange, and SMD (PCB Mounted) Resistive Components
Documentation
REACH Certification of Compliance
Documentation
RoHS Certification of Compliance

Relevant Pages

Relevant Pages

Xinger® Components

Transceivers

RF and Specialty Components

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