Trusted Advanced Technology and PCB Manufacturing Solutions with
Global Production Options
Our global team collaborates with industry-leading innovators to deliver comprehensive, end-to-end support for advanced data center computing applications, enabling rapid time-to-market. Our customers provide their users with critical efficiencies and services. We collaborate with our customers to deliver printed circuit board fabrication. TTM’s global footprint and close relationships with our suppliers help mitigate risks in our customers’ supply chain.
Next-Generation Computing Starts with TTM
Artificial Intelligence ("AI") and Machine Learning ("ML") require sophisticated computing power and specialized, high-performance printed circuit board solutions. The immense computational demands for AI training and influencing push the boundaries of traditional data center infrastructure. TTM leverages its expertise in advanced materials and complex designs to provide high-density interconnect (HDI) and thermal management solutions for GPUs, AI accelerators, and high-speed networking equipment, ensuring the reliability and performance necessary for AI applications.
Growing demand for online services such as social networking, video streaming services, and online gaming has driven dramatic growth in the hyperscale market. The ability to quickly scale with flexibility and high computational power can be an extreme challenge. TTM works with our customers to ensure high reliability combined with optimum performance and cost-competitive solutions to meet this critical market sector's needs.
Cloud Computing services help enterprises improve business efficiency and reduce costs. This has resulted in increased opportunities for utilizing big data, machine learning, and scalability while ensuring a secure platform from cybersecurity attacks. TTM works closely with our customers to make sure their products will operate efficiently in any environment or application. We work extensively with various applications, from application-specific integrated circuit ("ASIC") design through volume hyperscale providers to ensure reliability and performance.
The demands around the microprocessor market continue to accelerate across several areas. The need for high speed, low latency, and lower power consumption continues to create various challenges. TTM has extensive experiences in material selection, thermal management, and high-density solutions to meet these needs. We are experts in supplying high technology reference designs for the latest high-end server and advanced data center computing applications.