Markets We Serve

Computing Capabilities

TTM Delivers Computing Capabilities to Support Our Customers' Innovative Applications.

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TTM Offers Critical PCB Technologies to Support Computing Applications

Backdrilling
Large Format Backplane
High Speed Backplane
HDI
Backplane Integration Line
Kelvin Test
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More Capabilities to Support Advanced Computing

In addition to the above, TTM provides full lifecycle support and broad offerings of printed circuit board, RF/microwave, and engineered solutions for our customers in both commercial and non-commercial industries. Other examples of capabilities we offer to support our high-end computing customers include:

  • Lead-free manufacturing
  • Ultra-high aspect ratio
  • Via fill
  • 50+ layers
  • RF and Specialty components
  • Seamless transfer from prototype to volume production
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Locations that Support Your Innovative Applications

OPCM
  • HDI
  • Sequential
  • Hybrid structures
  • Multiple surface finishes

 

Chippewa Falls Plant
  • High-layer count designs
  • Laser microvias
  • Advanced materials
  • High-volume 2.0 core material

 

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Learn More about TTM’s Computing Possibilities
Learn More about TTM’s Computing Possibilities

Computing

Computing Applications

Questions about our capabilities?

Discover how TTM can support your innovative products.