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TTM Tech Academy

On-Demand Resources

TTM Tech Academy is an Educational Resource Hub for Technology Professionals.

On-Demand Resources from
TTM Tech Academy

Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.

Webinar Recordings

TTM’s global team of engineers has created a series of webinars to provide insight and best practices regarding PCB and RF components manufacturing, as well as emerging technology trends. Sign up for our newsletter to stay tuned for more recorded and live sessions from our subject matter experts.

Latest Webinar Recordings

Optimization and Recommendations on Implementing TTM Xinger® RF Passive Components in All Applications

This webinar explores TTM RF & Specialties Xinger® Components, in all aspects of their implementation into modern RF systems...

eBooks

5 Essential PCB Design Best Practices

2017

5G Challenges for PCB Fabrication

2019

Rigid-Flex Technology & Applications

2019

TTM Digest – Monthly Newsletter

Digest issue
Editorial Topics
Link
Sep-24
Discover PCB Innovations with TTM Technologies
Aug-24
Bringing 5G/5.5G Applications to Life
SUMMER-24
TM Technologies Q2, 2024 Results released and more…
May-24
Enhancing Healthcare through Advanced PCB Technology
Apr-24
TTM Technologies Q1 2024 results released and more…
Mar-24
TTM Penang is officially open and more…
Feb-24
Boost Accessibility & Collaboration with Cloud Computing
Jan-24
TTM Technologies Q4, 2023 Results released and more…

TTM TECHMINUTE

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

- To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

- How to bend the cores together? (Mandarin with English subtitles)

Tom Buck - Project Manager, RF Technology

- What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?

Andy Cameron - Field Applications Engineering Manager

- How oxide processes can impact insertion loss?

Randy Mattsen - Senior Field Applications Engineer

- What properties are the most important when selecting PCB materials?

Nick Koop - Director of Flex Technology

- What is the maximum copper density spec for flex construction?