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TTM TECHMINUTE
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
- To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
- How to bend the cores together? (Mandarin with English subtitles)
Tom Buck - Project Manager, RF Technology
- What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?
Andy Cameron - Field Applications Engineering Manager
- How oxide processes can impact insertion loss?
Randy Mattsen - Senior Field Applications Engineer
- What properties are the most important when selecting PCB materials?
Nick Koop - Director of Flex Technology
- What is the maximum copper density spec for flex construction?
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