On-Demand Resources from
TTM Tech Academy
Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.
Webinar Recordings
Latest Webinar Recordings
Thermal Considerations and Operational Excellence of the Xinger Coupler
This webinar highlights the thermal considerations and how Xinger Couplers are the best solutions. We will be covering: High Temperature Risks, Xinger Reliability and Power Handling, Customer PCB & System Design, and much more.
Other Webinar Recordings
Publications
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TTM TECHMINUTE
Kelter Lee - Principal Field Application Engineer
Ep 20 - Can Automated Visual Inspection ("AVI") inspect internal layers, or only inspect the defects of the outer layer?
Kelter Lee - Principal Field Application Engineer
Ep 19 - How do you choose between resin plug holes and copper-filled holes?
Kelter Lee - Principal Field Application Engineer
Ep 18 - For the pressing process, if the copper foil is too smooth, will it affect the pressing quality?
Kelter Lee - Principal Field Application Engineer
Ep 17 - PCB must be baked before being surface-mounted. What are the potential factors that lead to PCB bending after baking?
Kelter Lee - Principal Field Application Engineer
Ep 16 - After tin stripping, is it pattern plating? What are the steps involved in the pattern plating process?
Kelter Lee - Principal Field Application Engineer
Ep 15 - What are the differences between Laser Direct Imaging (“LDI”) and Direct Imaging (“DI”) in soldermask application
Richard Dang - Field Application Engineer
Ep 12 - How can you work with the PCB manufacturer to reduce the soldermask thickness on PCBs?
Richard Dang - Field Application Engineer
Ep 11 - Is there any cost impact between via plug vs soldermask open?
Richard Dang - Field Application Engineer
Ep 10 - Regarding Via Tenting, what if the mask is "partially" over the via pad, leaving the hole open?
Richard Dang - Field Application Engineer
Ep 9 - Can you compare the cost of Edge Plating vs Edge Pinning Vias?
Mark Bowyer -Director, Business Development - RF&S
Ep 8 - How are the introduced data or components different from the available market solutions?
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
Ep 7 - To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
Ep 6 - Can we directly replace laser vias with backdrills? (Mandarin with English subtitles)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
Ep 5 - How to bend the cores together? (Mandarin with English subtitles)
Tom Buck - Project Manager, RF Technology
Ep 4 - What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?
Andy Cameron - Field Applications Engineering Manager
Ep 3 - How oxide processes can impact insertion loss?
Randy Mattsen - Senior Field Applications Engineer
Ep 2 - What properties are the most important when selecting PCB materials?
Nick Koop - Director of Flex Technology
Ep 1 - What is the maximum copper density spec for flex construction?
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