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RF and Microwave PCB

We Specialize in Industry-Leading RF and Microwave PCBs and Components for Diverse End-Markets.

Innovative Engineering and Advanced Process Capabilities

From defense, space, and aerospace electronics, to medical devices, imaging, complex telecommunications equipment, to 5G enablement, and mmWave automotive radar, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W).  We have extensive experience with a wide range of low-loss laminate materials and a total of over 70 resin systems.

We are investing in research and development to provide our customers with data regarding signal integrity, materials, and high-reliability design for manufacture guidance to ensure our customers RF/Microwave reliant applications meet the needs of the market and stringent standards for quality and performance required for specific industries and reliability in the field. TTM has a dedicated Signal Integrity Lab and continues to provide industry-leading research and development in collaboration with the customers we serve.

Our broad product offerings and one-stop capabilities provide our customers with complete product lifecycle support; we have a range of engineered thermal solutions, high-current testing capabilities, low-temperature cofired ceramics (LTCC) solutions, microwave attenuators, and so much more to ensure we add value at each stage of the product’s journey from NPI to end-of-life. Our rigorous testing and adherence to internationally recognized quality and environmental standards are just a few reasons why TTM’s teams are recognized as exceptional and why leading brands worldwide trust our advanced technology solutions.

Our Capabilities

  • +/- 0.0005" (12.7um) standard tolerance on etched features for un-plated 0.5oz copper
  • Selective plated up layers allowing +/- 0.0005" (12.7um) etch tolerances
  • Exact registration / laser direct imaging
  • Front to back registration of etched cores to +/-0.001" (25.4um)
  • Hybrid dielectric material constructions
  • Buried via / blind via / microvia
  • Ormet paste for z-axis interconnects
  • Multi-level cavity constructions
  • Optical milling / drilling
  • Laser routing / machining
  • Sequential lamination
  • Polytetrafluoroethylene ("PTFE") Fusion Bond
  • Formed PCBs
  • Plated edges and slots


  • Mechanical back-drilling (minimal stub)
  • Laser drilling (no stub)
  • Laser modified controlled depth drill (mechanical drill followed by laser clean-up, no stub)
  • Multi-functional hole technology allowing two nets in one hole location


  • Via-In-Pad-Plated-Over (VIPPO) with conductive and non-conductive epoxy
  • Solid copper plated microvia and small mechanical drilled plated through vias
  • Partial hole-fill options


    • Copper coins and slugs
    • HDVP & ThermalVia®
    • Metal core, metal backed, and IMS
    • Thermally conductive laminates
    • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards


    • Planar Resistors / Capacitors
      • Ohmega and ticer
      • Screened ink resistors
      • Planar capacitance materials: laminate, film based and High dielectric constant ("Dk") filled
    • Circulators
      • On-board circuit
      • Embedded ferrites
    • Embedded passive components
    • Electroless Nickel, Immersion Gold ("ENIG") standard solder assemblies
    • Electroless Nickel, Electroless Palladium, Immersion Gold ("ENEPIG")
    • Electroless Palladium, Immersion Gold ("EPIG")
    • Hard and soft wire-bondable gold
    • Immersion silver
    • OSP


    • RF assembly of connector, surface mount component, drop-in cavity components, hand, and automated solder assembly options
    • RF test centers have extensive engineering and test capabilities, including multiple Network Analyzers with combined frequency sweep coverage up to 110 GHz.
    • RF and Microwave dielectric material test and characterization capabilities
    • 3D laser scanning for copper foil profile analysis
    • 2D Static field solvers as well as 3D full-wave simulation capability
    • Custom anechoic boxes for antenna measurements
    • Switch matrix capability for multiple measurements between human interaction
    • Switch matrix capability for multiple measurements between human interaction


    HFSS 3D Full Wave Simulation Capabilities

    Our dedicated field applications engineers provide collaborative engineering support for the full product lifecycle, from inception to the field.

    Qualifications/Certifications include; MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP, IATF 16949, ISO 9001, ISO 14001, ISO/IEC 17025, TL 9000-H, Bellcore Compliance, and OHSAS, as well as Automotive TS 16949 and Medical ISO 13485 certifications. 

    Relevant Pages

    Relevant Pages

    Signal Integrity Lab

    RF and Specialty Components


    Thermal Management

    Engineering and Design

    Related Resources

    Rigid-Flex (English)
    Thermal Management Solutions (English)
    RF Technical Bulletin
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