About TTM

Corporate Structure

Our Combination for Success and Customer Service Excellence.

Organized for Performance and Complete Product Lifecycle Support

TTM has a highly diversified revenue base covering key growth markets and over 1,000 customers worldwide. We cover varied industries, each characterized by rapid product introduction cycles and demand for time-critical services followed by full-scale production.

The approximately 17,000 employees who make up TTM are an essential part of our business. No matter what role an individual plays in the company, from equipment operator to CEO, each employee makes a vital contribution to our success.

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Business Units Provide Deep Expertise and Support for Our Customer Segments

Aerospace & Defense/ Specialty (A&D) Business Unit

Supports customers in the aerospace sector with an emphasis on commercial aerospace, defense, and space technologies.”  

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Automotive & Medical, Industrial & Instrumentation (AMI&I) Business Unit

Supports customers in the automotive space. Also includes a wide range of medical & industrial applications.

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Communications & Computing (C&C) Business Unit

Supports customers in the networking, telecom, and computing markets.

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RF & Specialty Components (RF&S) Business Unit

Supports customers in the wireless infrastructure market with RF component solutions.

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Our Executive Leadership Team

Thomas T. Edman
President and Chief Executive Officer

Thomas T. Edman is the CEO of our company since January 2014 and President since January 2013. Mr. Edman has also served as a Director for our company since September 2004. From early 2011 to December 2012, Mr. Edman served as Group Vice President and General Manager of the AKT Display Business Group, which is a division of Applied Materials Inc., a publicly held provider of nanomanufacturing technology solutions. From 2006 to 2011, Mr. Edman served as Corporate Vice President of Corporate Business Development of Applied Materials, Inc. Before that, Mr. Edman served as President and Chief Executive Officer of Applied Films Corporation from May 1998 until Applied Materials, Inc. acquired Applied Films Corporation in July 2006. From June 1996 until May 1998, Mr. Edman served as Chief Operating Officer and Executive Vice President of Applied Films Corporation. From 1993 until joining Applied Films, Mr. Edman served as General Manager of the High-Performance Materials Division of Marubeni Specialty Chemicals, Inc., a subsidiary of a major Japanese trading corporation. Mr. Edman holds a Bachelor of Arts degree in East Asian studies (Japan) from Yale University and a Master's degree in Business Administration from The Wharton School at the University of Pennsylvania.

 

 

 

Thomas T. Edman
President and Chief Executive Officer

Thomas T. Edman is the CEO of our company since January 2014 and President since January 2013. Mr. Edman has also served as a Director for our company since September 2004. From early 2011 to December 2012, Mr. Edman served as Group Vice President and General Manager of the AKT Display Business Group, which is a division of Applied Materials Inc., a publicly held provider of nanomanufacturing technology solutions. From 2006 to 2011, Mr. Edman served as Corporate Vice President of Corporate Business Development of Applied Materials, Inc. Before that, Mr. Edman served as President and Chief Executive Officer of Applied Films Corporation from May 1998 until Applied Materials, Inc. acquired Applied Films Corporation in July 2006. From June 1996 until May 1998, Mr. Edman served as Chief Operating Officer and Executive Vice President of Applied Films Corporation. From 1993 until joining Applied Films, Mr. Edman served as General Manager of the High-Performance Materials Division of Marubeni Specialty Chemicals, Inc., a subsidiary of a major Japanese trading corporation. Mr. Edman holds a Bachelor of Arts degree in East Asian studies (Japan) from Yale University and a Master's degree in Business Administration from The Wharton School at the University of Pennsylvania.

 

 

 

Canice T. K. Chung
Advisor to the CEO Business Development, Asia Pacific

Canice T. K. Chung is the Asia Pacific Business Development Advisor to the CEO. He had served as our Executive Vice President and President, Asia Pacific Business Unit since April 2012, and prior to that served as Chief Executive Officer of our Asia Pacific operating segment since April 8, 2010. Prior to joining our company, Mr. Chung served as Deputy Managing Director of Meadville Group since 2005. Prior to joining the Meadville Group, Mr. Chung was an Executive Director of Elec & Eltek International Holdings Limited (formerly listed on The Stock Exchange of Hong Kong Limited) from August 1993 to March 2005 and Elec & Eltek International Company Limited (a company listed on the Singapore Exchange Securities Trading Limited) from April 1994 to March 2005. Mr. Chung had been Chief Executive Officer of Elec & Eltek Group's PCB business and held various management positions at Fairchild Semiconductors (HK) Limited, China Cement Company (Hong Kong) Limited, the Astec Group and Chen Hsong Machinery Co, Limited. Mr. Chung graduated from the Hong Kong Polytechnic University in 1979 in Accountancy. Mr. Chung is currently the Chairman of the Hong Kong Printed Circuit Association Limited.

 

Canice T. K. Chung
Advisor to the CEO Business Development, Asia Pacific

Canice T. K. Chung is the Asia Pacific Business Development Advisor to the CEO. He had served as our Executive Vice President and President, Asia Pacific Business Unit since April 2012, and prior to that served as Chief Executive Officer of our Asia Pacific operating segment since April 8, 2010. Prior to joining our company, Mr. Chung served as Deputy Managing Director of Meadville Group since 2005. Prior to joining the Meadville Group, Mr. Chung was an Executive Director of Elec & Eltek International Holdings Limited (formerly listed on The Stock Exchange of Hong Kong Limited) from August 1993 to March 2005 and Elec & Eltek International Company Limited (a company listed on the Singapore Exchange Securities Trading Limited) from April 1994 to March 2005. Mr. Chung had been Chief Executive Officer of Elec & Eltek Group's PCB business and held various management positions at Fairchild Semiconductors (HK) Limited, China Cement Company (Hong Kong) Limited, the Astec Group and Chen Hsong Machinery Co, Limited. Mr. Chung graduated from the Hong Kong Polytechnic University in 1979 in Accountancy. Mr. Chung is currently the Chairman of the Hong Kong Printed Circuit Association Limited.

 

Catherine Gridley
Executive Vice President and President Aerospace & Defense/Specialty Business Unit

Catherine Gridley is the Executive Vice President and President of the Aerospace & Defense/Specialty Business Unit. She joined TTM in 2019 from Northrop Grumman Corporation, where she most recently served as the Vice President and General Manager of the Advanced Defense Services Division. Prior to Northrop Grumman, Catherine held P&L leadership positions with DynCorp International, GE Aviation Systems and Goodrich. She earned her Bachelor of Science in Accounting from Ithaca College and MBA from Binghamton University.

 

Catherine Gridley
Executive Vice President and President Aerospace & Defense/Specialty Business Unit

Catherine Gridley is the Executive Vice President and President of the Aerospace & Defense/Specialty Business Unit. She joined TTM in 2019 from Northrop Grumman Corporation, where she most recently served as the Vice President and General Manager of the Advanced Defense Services Division. Prior to Northrop Grumman, Catherine held P&L leadership positions with DynCorp International, GE Aviation Systems and Goodrich. She earned her Bachelor of Science in Accounting from Ithaca College and MBA from Binghamton University.

 

Kent Hardwick
Senior Vice President Global Sales and EMS

Kent Hardwick is the Senior Vice President of Global Sales and EMS. Mr. Hardwick began his career in sales management with Sigma Circuits in 1982, developing regional sales territories throughout North America. In 1992, Kent was promoted to Director of Business Development at Sigma, managing the growth and direction of vital multinational accounts. In 1996, Mr. Hardwick was elevated to Vice President of Sales and Marketing at Sigma Circuits and successfully led the sales organization through the acquisition by Tyco Electronics in 1998. At Tyco Electronics, Mr. Hardwick was responsible for cultivating the key global account customer base and developing the teams that support them. In 2006, TTM Technologies acquired the Tyco Printed Circuit Group. As Director of Business Development for TTM, Mr. Hardwick managed the growth and transition of critical customer groups. In 2008, Kent was promoted to Vice President of the Global E-MS Business division before his role as SVP of Global Sales for the Company. Mr. Hardwick received his Bachelor's degree in Business Administration from California State University, Hayward.

 

Kent Hardwick
Senior Vice President Global Sales and EMS

Kent Hardwick is the Senior Vice President of Global Sales and EMS. Mr. Hardwick began his career in sales management with Sigma Circuits in 1982, developing regional sales territories throughout North America. In 1992, Kent was promoted to Director of Business Development at Sigma, managing the growth and direction of vital multinational accounts. In 1996, Mr. Hardwick was elevated to Vice President of Sales and Marketing at Sigma Circuits and successfully led the sales organization through the acquisition by Tyco Electronics in 1998. At Tyco Electronics, Mr. Hardwick was responsible for cultivating the key global account customer base and developing the teams that support them. In 2006, TTM Technologies acquired the Tyco Printed Circuit Group. As Director of Business Development for TTM, Mr. Hardwick managed the growth and transition of critical customer groups. In 2008, Kent was promoted to Vice President of the Global E-MS Business division before his role as SVP of Global Sales for the Company. Mr. Hardwick received his Bachelor's degree in Business Administration from California State University, Hayward.

 

Dale Knecht
Senior Vice President Global Information Technology

Dale Knecht is the Senior Vice President of Global Information Technology. From 2001 to 2006, Mr. Knecht served as Vice President of Information Technology for the Tyco Electronics Printed Circuit Group. From 2003 to 2006, Mr. Knecht served in a dual role as Director of IT Regional Governance - North America for Tyco Electronics. Before that, Mr. Knecht served from 1998 to 2001 as Manager, SAP Global Support, and from 1993 to1998 as Regional Systems Manager - Latin America & Canada for AMP Inc. Mr. Knecht holds a Bachelor of Science in Mathematics from Lafayette College and an Executive Master in Cybersecurity degree from Brown University.

 

 

Dale Knecht
Senior Vice President Global Information Technology

Dale Knecht is the Senior Vice President of Global Information Technology. From 2001 to 2006, Mr. Knecht served as Vice President of Information Technology for the Tyco Electronics Printed Circuit Group. From 2003 to 2006, Mr. Knecht served in a dual role as Director of IT Regional Governance - North America for Tyco Electronics. Before that, Mr. Knecht served from 1998 to 2001 as Manager, SAP Global Support, and from 1993 to1998 as Regional Systems Manager - Latin America & Canada for AMP Inc. Mr. Knecht holds a Bachelor of Science in Mathematics from Lafayette College and an Executive Master in Cybersecurity degree from Brown University.

 

 

Paul C.T. Liu
Senior Vice President Asia Pacific Operations

Paul C.T. Liu is the Senior Vice President of Asia Pacific Operations. Before this position, Mr. Liu was the Vice President of Operations for the AMI&I Business Unit since 2016. In 2013, Mr. Liu joined Viasystems Inc. as the Vice President of Operations in Asia. Before that, from 2003 to 2012, Mr. Liu served and held many leadership roles in Gold Circuit Electronics Ltd., a publicly-traded company with four manufacturing plants in Asia, as the President of Operations, Executive Vice President and Vice President of Operations. From 2001 to 2003, Mr. Liu served in ACP Co., Ltd., a joint venture of Chin Poon Industrial of Taiwan and Aspocomp of Finland, as a plant manager. From 1995 to 2001, Mr. Liu was a co-founder of a factory that manufactured EMI shielding for laptops and processes for PCBs. Mr. Liu began his career in the printed circuit board industry in 1982 with Compeq Manufacturing Co., Ltd as an engineer and later served as a supervisor and manager until 1995. Mr. Liu graduated in Electrical Engineering from the National Kaohsiung Institute of Technology, Taiwan. 

 

 

Paul C.T. Liu
Senior Vice President Asia Pacific Operations

Paul C.T. Liu is the Senior Vice President of Asia Pacific Operations. Before this position, Mr. Liu was the Vice President of Operations for the AMI&I Business Unit since 2016. In 2013, Mr. Liu joined Viasystems Inc. as the Vice President of Operations in Asia. Before that, from 2003 to 2012, Mr. Liu served and held many leadership roles in Gold Circuit Electronics Ltd., a publicly-traded company with four manufacturing plants in Asia, as the President of Operations, Executive Vice President and Vice President of Operations. From 2001 to 2003, Mr. Liu served in ACP Co., Ltd., a joint venture of Chin Poon Industrial of Taiwan and Aspocomp of Finland, as a plant manager. From 1995 to 2001, Mr. Liu was a co-founder of a factory that manufactured EMI shielding for laptops and processes for PCBs. Mr. Liu began his career in the printed circuit board industry in 1982 with Compeq Manufacturing Co., Ltd as an engineer and later served as a supervisor and manager until 1995. Mr. Liu graduated in Electrical Engineering from the National Kaohsiung Institute of Technology, Taiwan. 

 

 

Shawn Powers
Senior Vice President Human Resources

Shawn Powers is the Senior Vice President of Human Resources. Mr. Powers joined TTM Technologies in March 2014 as the Vice President of Human Resources for our North America Business Unit. Before joining our company, Mr. Powers was the Global Vice President of Human Resources with Kleinfelder, an engineering and sciences company, from 2012 to 2014. Before Kleinfelder, Mr. Powers was the Senior Director of Global Human Resources with IMI plc, an FTSE 100 manufacturing company, from 2006 to 2012. Mr. Powers began his career in the U.S. Military, serving as an Army Aviation Officer. Mr. Powers holds both a Master of International Affairs and a Bachelor of Science degree in Biomedical Science from Texas A&M University. Additionally, he has earned the Global Professional of Human Resources (GPHR) and the Society of Human Resources Professional - Senior Certified Professional (SCP) certifications.

 

Shawn Powers
Senior Vice President Human Resources

Shawn Powers is the Senior Vice President of Human Resources. Mr. Powers joined TTM Technologies in March 2014 as the Vice President of Human Resources for our North America Business Unit. Before joining our company, Mr. Powers was the Global Vice President of Human Resources with Kleinfelder, an engineering and sciences company, from 2012 to 2014. Before Kleinfelder, Mr. Powers was the Senior Director of Global Human Resources with IMI plc, an FTSE 100 manufacturing company, from 2006 to 2012. Mr. Powers began his career in the U.S. Military, serving as an Army Aviation Officer. Mr. Powers holds both a Master of International Affairs and a Bachelor of Science degree in Biomedical Science from Texas A&M University. Additionally, he has earned the Global Professional of Human Resources (GPHR) and the Society of Human Resources Professional - Senior Certified Professional (SCP) certifications.

 

Todd B. Schull
Executive Vice President and Chief Financial Officer

Todd B. Schull became our Executive Vice President, Chief Financial Officer, Treasurer and Secretary in March 2013, having joined our company as an Executive Vice President in February 2013. Before joining TTM, Mr. Schull served as Senior Vice President of Finance and Corporate Controller of Sanmina Corporation. Before joining Sanmina, Mr. Schull was Corporate Controller of Ultratech from 2003 to 2005. Mr. Schull started his career with Deloitte LLP and then held leadership positions with Verbatim Corporation, Solectron Corporation, Tidal Software, Repeater Technologies, and VA Linux. Mr. Schull holds a Bachelor of Science degree in accounting from the University of Utah.

 

Todd B. Schull
Executive Vice President and Chief Financial Officer

Todd B. Schull became our Executive Vice President, Chief Financial Officer, Treasurer and Secretary in March 2013, having joined our company as an Executive Vice President in February 2013. Before joining TTM, Mr. Schull served as Senior Vice President of Finance and Corporate Controller of Sanmina Corporation. Before joining Sanmina, Mr. Schull was Corporate Controller of Ultratech from 2003 to 2005. Mr. Schull started his career with Deloitte LLP and then held leadership positions with Verbatim Corporation, Solectron Corporation, Tidal Software, Repeater Technologies, and VA Linux. Mr. Schull holds a Bachelor of Science degree in accounting from the University of Utah.

 

Douglas L. Soder
Executive Vice President and President Commercial Sector

 

Douglas L. Soder is Executive Vice President and the President of the Commercial Sector. Mr. Soder joined TTM in 2006 and previously held the positions of EVP and President of Communications and Computing Business Unit from 2015 to 2018, EVP and President of North America Business Unit from 2012 through 2015, and EVP Global Sales from 2006 to 2012. Before joining TTM in 2006, he was Executive Vice President of Tyco Electronics - Printed Circuit Group, a position he held from 2001. Mr. Soder began his career in the electronics industry in 1983 with AMP Incorporated, and held many sales and sales management assignments with AMP Incorporated, Tyco Printed Circuit Group and AMP-AKZO before becoming Vice President of Sales with Tyco Electronics - Printed Circuit Group in 1996. Mr. Soder received his Bachelor of Arts in Political Science from Dickinson College in 1983.

 

Douglas L. Soder
Executive Vice President and President Commercial Sector

 

Douglas L. Soder is Executive Vice President and the President of the Commercial Sector. Mr. Soder joined TTM in 2006 and previously held the positions of EVP and President of Communications and Computing Business Unit from 2015 to 2018, EVP and President of North America Business Unit from 2012 through 2015, and EVP Global Sales from 2006 to 2012. Before joining TTM in 2006, he was Executive Vice President of Tyco Electronics - Printed Circuit Group, a position he held from 2001. Mr. Soder began his career in the electronics industry in 1983 with AMP Incorporated, and held many sales and sales management assignments with AMP Incorporated, Tyco Printed Circuit Group and AMP-AKZO before becoming Vice President of Sales with Tyco Electronics - Printed Circuit Group in 1996. Mr. Soder received his Bachelor of Arts in Political Science from Dickinson College in 1983.

 

Phil Titterton
Executive Vice President and Chief Operating Officer

Phil Titterton is Executive Vice President and the Chief Operating Officer. Most recently, Phil served as the President of the Aerospace & Defense / Specialty Business Unit. Before that position, Phil was the Chief Operating Officer of TTM's North America Business Unit, and from 2006 to 2014 held many leadership roles including Vice President Operations of TTM's North America Business Unit, Vice President of the Aerospace and Defense Operations, as well as General Manager of the Stafford Division. He also held positions as Vice President of Operations and General Manager for Tyco Electronics Printed Circuit Group from 1992 to 2006 before TTM Technologies acquired them. Mr. Titterton began his career in 1987 as an Operations Manager at Proctor and Gamble, followed by an Operations Consulting role at Coopers & Lybrand based out of NYC. Phil holds a Bachelor's Degree in Electrical Engineering from Lehigh University.

 

Phil Titterton
Executive Vice President and Chief Operating Officer

Phil Titterton is Executive Vice President and the Chief Operating Officer. Most recently, Phil served as the President of the Aerospace & Defense / Specialty Business Unit. Before that position, Phil was the Chief Operating Officer of TTM's North America Business Unit, and from 2006 to 2014 held many leadership roles including Vice President Operations of TTM's North America Business Unit, Vice President of the Aerospace and Defense Operations, as well as General Manager of the Stafford Division. He also held positions as Vice President of Operations and General Manager for Tyco Electronics Printed Circuit Group from 1992 to 2006 before TTM Technologies acquired them. Mr. Titterton began his career in 1987 as an Operations Manager at Proctor and Gamble, followed by an Operations Consulting role at Coopers & Lybrand based out of NYC. Phil holds a Bachelor's Degree in Electrical Engineering from Lehigh University.

 

Dan Weber
Executive Vice President and General Counsel and Corporate Secretary

Dan Weber leads the Office of the General Counsel which includes the contracts and administration function. Before joining TTM in 2015, Dan served as the General Counsel for Viasystems for approximately 11 years and had served as in-house counsel for Viasystems for over 15 years. Dan previously also served as Vice President and General Counsel of Courtesy Corporation, a plastic molding manufacturer based in the United States, and as General Counsel of International Wire Group, Inc., a multinational insulated and bare copper wire manufacturer. Prior to embarking on his in-house legal career, Dan worked in private practice at Gallop, Johnson & Neuman, L.C. in the corporate and securities group. Mr. Weber completed his undergraduate work from University of Kansas and received his Law Degree from St. Louis University.

 

Dan Weber
Executive Vice President and General Counsel and Corporate Secretary

Dan Weber leads the Office of the General Counsel which includes the contracts and administration function. Before joining TTM in 2015, Dan served as the General Counsel for Viasystems for approximately 11 years and had served as in-house counsel for Viasystems for over 15 years. Dan previously also served as Vice President and General Counsel of Courtesy Corporation, a plastic molding manufacturer based in the United States, and as General Counsel of International Wire Group, Inc., a multinational insulated and bare copper wire manufacturer. Prior to embarking on his in-house legal career, Dan worked in private practice at Gallop, Johnson & Neuman, L.C. in the corporate and securities group. Mr. Weber completed his undergraduate work from University of Kansas and received his Law Degree from St. Louis University.

 

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