Substrate-Like ("SLP") PCB

HyperBGA® fluoropolymer-based coreless semiconductor package allows your die to run at extremely high speeds. The combination of low-loss, low dielectric constant material and stripline cross-sections enables signal speeds surpassing 25 GHz. And, this signal speed can be much higher (>70 GHz) over shorter distances.

The PTFE material compliance combines with the dimensional stability of a copper-invar-copper ("CIC") center plane to enable a long field life for HyperBGA® by reducing and eliminating the BGA wear out, die cracking, delamination, and flip-chip bump fatigue of other plastic packages.

It's the solution for networking, high-end server, telecommunications, military, and medical markets — any place where speed, reliability, and increased signal I/O must combine with reduced size, weight, and power ("SWaP").

This low-stress flip-chip laminate package is ideal for multi-layer, RF, chip-on-flex, or any application requiring a system-in-package ("SiP") approach.

Resonac and ABF (Ajinomoto Build-up Film) IC substrate solutions leverage high density, low-CTE dielectric buildup materials to deliver a highly reliable, high yield packaging architecture for modern semiconductor devices. By utilizing standard "off the shelf" dielectric films and core materials, this platform offers an easily accessible and cost-effective alternative to proprietary custom laminates, streamlining supply chain procurement and accelerating time to market.

Engineered with superior dimensional stability, low thermal expansion, and fine pitch line/space capabilities, ABF based substrates enable dense microvia laser drilling, fine Flip Chip Assembly (FCA) pitch compatibility, and high layer count signal routing. Furthermore, the platform supports tight FCA bump pitch down to fine micropad geometries, ensuring reliable interconnect density for high I/O advanced packaging. The result is an optimized thermal and electrical solution ideal for RF applications, AI accelerators, high-performance computing, telecommunications, and consumer electronics. It delivers excellent warpage control, robust power distribution, and high frequency signal integrity while maintaining a flexible industry standard material ecosystem.