Meeting Advanced Technology Challenges with Industry-leading R&D Solutions
At TTM, innovation is the key to our ongoing success as a leading global manufacturer of technology products. Since 1998, TTM has grown and developed, and now has 100+ patents that provide our customers with leading-edge solutions to bring game-changing, advanced technology applications to market.
Our Patented FLAT WRAP™ Technology
TTM's engineering teams have developed an innovative process: FLAT-WRAP™ Technology. This patented technology eliminates the need for additional surface-plated copper required to meet the IPC specification for wrap plating (ref. IPC 6012B Amendment 1 p. 3.6.2.11.1). FLAT-WRAP™ Technology results in consistent wrap plate thickness matching the thickness of the initial surface foil.
TTM FLAT-WRAP™ Technology provides the following benefits:
- Increased reliability due to wrap plate uniformity over the entire panel surface
- Elimination of copper thickness build-up during multiple wrap plating cycles on a common layer
- Improved surface plating distribution provides consistent impedance values on the plated layers with via-filled holes
- Improved dielectric thickness on all sub-laminations between the sub-outer plated layer and the subsequent laminated layer
- Reduced surface copper thickness enables designs with fine lines and tighter geometries
- Improved soldermask thickness uniformity due to reduced copper feature height
More Examples of TTM’s Patented Intellectual Property
- Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap
- Wideband RF device
- RF attenuator device and system
- RF termination
- Methods for fabricating printed circuit board assemblies with high density via array
- Printed circuit board assemblies with engineered thermal paths and methods of manufacture
- Directional couplers with dc insulated input and output ports