主要的印刷电路板技术包括
支持更多进阶计算机的能力
除上述内容外，迅达还为商业和非商业业务的客户提供完整的生命周期支持以及广泛的印刷电路板、射频（RF）和毫米波（mmWave）和工程解决方案。我们为高端计算机客户提供的支持包括：
- 无铅制造
- 超高宽高比
- 导通孔填充
- 50层以上
- 射频及专用组件
- 从原型到批量生产的无缝转移
• 高层数
• 激光微孔
• 进阶材料
• 高产量 2.0核心材料
TTM Guangzhou ("GZ") is best suited for advanced technology multi-layer PCB in volume application.
- High layer count
- Conventional and advanced HDI
- Oversized line card and backplanes
- Hybrid & sequential structures
- Thermal management
TTM Penang ("PNG") is our highly advanced technology-equipped facility in Southeast Asia.
- HDI
- Highly Automated Production Lines
- Multi-layered Printed Circuit Board
- Greenfield Facility
TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.
- Quick-turn, high-mix, low- to mid-volume
- Radar and LiDAR development
- Material development; polyphenylene oxide ("PPO"), teflon
- Flex, rigid-flex
- Advanced HDI, including 3+n+3
- High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
- Seamless transfer to volume production in Asia
- Diverse laminate materials from North America and Asia Pacific