Solutions

RF and Microwave PCB

We Specialize in Industry-Leading RF and Microwave PCBs and Components for Diverse End-Markets.

Innovative Engineering and Advanced Process Capabilities

From defense, space, and aerospace electronics, to medical devices, imaging, complex telecommunications equipment, to 5G enablement, and mmWave automotive radar, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W).  We have extensive experience with a wide range of low-loss laminate materials and a total of over 70 resin systems.

We are investing in research and development to provide our customers with data regarding signal integrity, materials, and high-reliability design for manufacture guidance to ensure our customers RF/Microwave reliant applications meet the needs of the market and stringent standards for quality and performance required for specific industries and reliability in the field. TTM has a dedicated Signal Integrity Lab and continues to provide industry-leading research and development in collaboration with the customers we serve.

Our broad product offerings and one-stop capabilities provide our customers with complete product lifecycle support; we have a range of engineered thermal solutions, high-current testing capabilities, low-temperature cofired ceramics (LTCC) solutions, microwave attenuators, and so much more to ensure we add value at each stage of the product’s journey from NPI to end-of-life. Our rigorous testing and adherence to internationally recognized quality and environmental standards are just a few reasons why TTM’s teams are recognized as exceptional and why leading brands worldwide trust our advanced technology solutions.

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Our Capabilities

  • +/- 0.0005" (12.7um) standard tolerance on etched features for un-plated 0.5oz copper
  • Selective plated up layers allowing +/- 0.0005" (12.7um) etch tolerances
  • Exact registration / laser direct imaging
  • Front to back registration of etched cores to +/-0.001" (25.4um)
  • Hybrid dielectric material constructions
  • Buried via / blind via / microvia
  • Ormet paste for z-axis interconnects
  • Multi-level cavity constructions
  • Optical milling / drilling
  • Laser routing / machining
  • Sequential lamination
  • Polytetrafluoroethylene ("PTFE") Fusion Bond
  • Formed PCBs
  • Plated edges and slots

 

  • Mechanical back-drilling (minimal stub)
  • Laser drilling (no stub)
  • Laser modified controlled depth drill (mechanical drill followed by laser clean-up, no stub)
  • Multi-functional hole technology allowing two nets in one hole location

 

  • Via-In-Pad-Plated-Over (VIPPO) with conductive and non-conductive epoxy
  • Solid copper plated microvia and small mechanical drilled plated through vias
  • Partial hole-fill options

 

  • Copper coins and slugs
  • HDVP & thermal via
  • Metal core, metal backed, and IMS
  • Thermally conductive laminates
  • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

 

  • Planar Resistors / Capacitors
    • Ohmega and ticer
    • Screened ink resistors
    • Planar capacitance materials: laminate, film based and High dielectric constant ("Dk") filled
  • Circulators
    • On-board circuit
    • Embedded ferrites
  • Embedded passive components
  • Electroless Nickel, Immersion Gold ("ENIG") standard solder assemblies
  • Electroless Nickel, Electroless Palladium, Immersion Gold ("ENEPIG")
  • Electroless Palladium, Immersion Gold ("EPIG")
  • Hard and soft wire-bondable gold
  • Immersion silver
  • OSP

 

  • RF assembly of connector, surface mount component, drop-in cavity components, hand, and automated solder assembly options
  • RF test centers have extensive engineering and test capabilities, including multiple Network Analyzers with combined frequency sweep coverage up to 110 GHz.
  • RF and Microwave dielectric material test and characterization capabilities
  • 3D laser scanning for copper foil profile analysis
  • 2D Static field solvers as well as 3D full-wave simulation capability
  • Custom anechoic boxes for antenna measurements
  • Switch matrix capability for multiple measurements between human interaction
  • Switch matrix capability for multiple measurements between human interaction

 

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HFSS 3D Full Wave Simulation Capabilities
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Our dedicated field applications engineers provide collaborative engineering support for the full product lifecycle, from inception to the field.

Qualifications/Certifications include; MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP, IATF 16949, ISO 9001, ISO 14001, ISO/IEC 17025, TL 9000-H, Bellcore Compliance, and OHSAS, as well as Automotive TS 16949 and Medical ISO 13485 certifications. 

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Relevant Pages
Relevant Pages

Signal Integrity Lab

RF and Specialty Components

Ceramics

Thermal Management

Engineering and Design

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Related Resources

Webinar

Rigid-Flex (English)

On-Demand
Webinar

Thermal Management Solutions (English)

On-Demand
Download

RF Technical Bulletin

2021
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