Thick Film Substrates

TTM's precision thick-film technology utilizes traditional thin-film technology; we can meet or exceed thin-film tolerances and at a more affordable price.

The APECS process lends itself to higher-frequency, higher-power density trends seen throughout today's RF and microwave applications. As frequencies increase, so does the importance of line-width and spacing tolerances along with keeping losses to a minimum. APECS offers both compared to competing technologies.

The APECS process combined with standard thick-film technology yields cost-effective, highly integrated multi-layer circuits. APECS substrates enable component integration (resistors, inductors, and capacitors) rather than applying discrete components using traditional component mounting.

A range of material choices is available with the APECS process, including:

• Ground plane metallization: Au, Pd/Au, Ag/Pd, Ag
• Photo-imaged and etched conductors and RF circuits: Au
• Dielectric and photo-imaged dielectric
• Mixed-metal multi-layer circuits
• Standard thick-film substrates: 96%, 99.5%, and 99.6% alumina, aluminum nitride and BeO, quartz and fused silica, and ferrites

TTM offers enormous design flexibility in terms of materials, circuit layout, embedded or non-embedded components, manufacturing techniques, and more.

• Sequentially applied layers of alternating conductor and dielectric to build up the multi-layer structure, affording you from one to eight conductor layers per side (single- or double-sided)
• Multiple sizes available starting at 0.020 x 0.020"
• Advanced laser machining capability for various shapes and cut-outs
• Wide resistance ranges from 0.2Ω to 50 GΩ
• Multiple termination materials, including Au, PdAu, Ag, PdAg
• Tin lead or Au plating available
• RF attenuators also available up to 18 GHz
• Integrated passives including resistors, capacitors, and inductors
• Available on alumina, aluminum nitride, BeO, ferrite, and more for a wide range of wire bonding, soldering, and brazing
• Choose edge wraps, metalized via fills, or both