迅达技术学术中心的随需资源
我们的全球工程专家团队为您呈献, 我们的资源涵盖了从入门到高阶的一系列主题。这些资源将增强您对新兴技术趋势的了解，并为您提供与印刷电路板和电子元件供应商更深层次接触而所需的知识，从而为您的应用带来更好的结果。
Webinar Recordings
Latest Webinar Recordings
Optimization and Recommendations on Implementing TTM Xinger® RF Passive Components in All Applications
This webinar explores TTM RF & Specialties Xinger® Components, in all aspects of their implementation into modern RF systems...
Latest Webinar Recordings
PCB 101 (in Mandarin)
Discover the world of PCB design, whether you are just starting out or refining your expertise
Other Webinar Recordings
Digest 期号
主题
链结
Nov-24
Driving Innovation: TTM Technologies' Role in the Future of Automotive Smart Antennas
订阅我们每月发送的企业新闻通讯“ TTM Digest”，助您了解最新的行业新闻、主题趋势和市场动态！
TTM TECHMINUTE
Richard Dang - Field Application Engineer
Ep 12 - How can you work with the PCB manufacturer to reduce the soldermask thickness on PCBs?
Richard Dang - Field Application Engineer
Ep 11 - Is there any cost impact between via plug vs soldermask open?
Richard Dang - Field Application Engineer
Ep 10 - Regarding Via Tenting, what if the mask is "partially" over the via pad, leaving the hole open?
Richard Dang - Field Application Engineer
Ep 9 - Can you compare the cost of Edge Plating vs Edge Pinning Vias?
Mark Bowyer -Director, Business Development - RF&S
Ep 8 - How are the introduced data or components different from the available market solutions?
Gavin Hung - 汽车及医疗，工业与仪器仪表业务部FAE经理
- To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
Ep 6 - Can we directly replace laser vias with backdrills? (Mandarin with English subtitles)
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