TTM Technologies
Advanced Analytical Capabilities
TTM Advanced Analytical Capabilities are strategically located across North America and the Asia Pacific, equipped with pilot printed circuit board ("PCB") fabrication equipment to accelerate the research and development progress of advanced high-density interconnect ("HDI"). HDI technology, surface treatment technology, advanced interconnection technology, and optical waveguide technology, such as picosecond laser drill, plasma cleaning machine, etc..
Led by the industry experts, we continuously innovate in the areas of failure analysis method development, surface analysis technology development, PCB product development, signal integrity analysis, and material analysis. Our global advanced analytical capabilities enable us to deliver high-quality and timely analytical solutions to customers worldwide.
Our Advanced Analytical Capabilities
- Insertion Loss Test Frequencies up to 110GHz 2
- Time Domain Reflectometry (TDR) - 20GHz 1, 2, 3 and 50GHz 1 Models
- 3D Electromagnetic Simulation 1, 2, 3
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
- Optical Insertion Loss Measurement with Multi-Mode Light Sources 1, 2
- Multi-Mode and Single-Mode Light Sources and Test Fibers 1, 2
- Optical Waveguide Signal Integrity Simulation 2
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
Non-Destructive Analysis
- Pinpoint Conductive Anode Filament ("CAF"), Micro-Short and Micro-Open at Elevated Temperature and Humidity 1
- Isolate Open or Short by Impedance and Radar Signal 1, 2, 3
- Locate Delamination and Voids by Acoustic Scan 1, 2
- Nano-Meter Scale Thin Layer Analysis 1
- Nano-Meter Scale Micro Via ("MV") Separation & Interconnect Defect ("ICD") Analysis 1, 2
- Inter Metallic Compound ("IMC") Characterization 1, 2
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
- Dielectric Constant ("Dk") and Dissipation Factor ("Df") 1, 2, 3
- Viscoelasticity Performance 1
- Loss Modulus and Storage Modulus 1, 3
- Glass Transition Temperature ("Tg") of Laminate 1, 2, 3
- Coefficient of Thermal Expansion ("CTE") of Materials 1, 2, 3
- Decomposition Temperature ("Td") of Laminate 1, 3
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
- Roughness and Profile 1, 2, 3
- Electrochemical Surface Analysis 1
- Warpage with Reflow Profile 1
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
- Current Induced Thermal Cycling ("CITC") 1, 2, 3, Highly Accelerated Stress Test ("HAST") 2, 3 for Thermal Stress
- Conductive Anode Filament ("CAF") 1, 2, 3
- Comparative Track Index ("CTI") and Proof Tracking Index ("PTI") to 1200V 1
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
- Trace Organic Analysis by High-performance Liquid Chromatography ("HPLC") 1
- Micro Analysis by Ultraviolet-Visible ("UV-Vis") Spectrophotometer 1, 3
Guangzhou Technology Center 1 North America Sites 2 Asia Pacific Sites 3
Inspiration from around the globe
Relevant Resources
