Engineering a Strong Future

Our engineering teams at TTM are at the forefront of technological advancement, driving innovation that translates directly into real-world impact. With an extensive portfolio of patents, our engineers don't just keep pace with industry trends—they set them. Day after day, these teams are relied upon to tackle complex challenges that demand creative problem-solving, technical expertise, and an unwavering commitment to excellence. It's this combination of innovation and practical application that positions us as a leader in delivering cutting-edge solutions that matter.

In 2025, our teams channeled their expertise into several high-impact Internal Research and Development ("IRAD") projects, all designed to advance our industry-leading product lines. Key initiatives included expanding the capabilities of our Passive Detection & Reporting System ("PDRS") and integrating cutting-edge ferrite technology into X-band circulators.

In parallel, our PCB engineering teams have been conducting comprehensive testing and evaluation of Sintering Paste Technology to determine its effects on production efficiency, quality, and performance. Each of these projects represents a strategic investment in the technologies that will define the next generation of TTM solutions.

Additional accomplishments include:

Microelectronics

TM20051

A radiation-hardened GaN driver Application Specific Integrated Circuit ("ASIC") is our flagship product in a new line of power management Integrated Circuits ("IC") developed by the Custom Integrated Circuit ("CIC") group. This and future CIC ASICs will be the building blocks for our advanced power management Multiple Chip Modules ("MCM") roadmap targeted for customer platforms operating in radiation-intensive environments such as Low-Earth-Orbit ("LEO") commercial and military satellites. 

Radiation-Hardened 3-amp Buck Converter 

We successfully designed and qualified a radiation-hardened 3-amp buck converter for demanding high-Earth-orbit space applications, completing rigorous total ionizing dose testing to verify performance in extreme radiation environments. This DC-DC power converter delivers regulated output voltages with high efficiency while withstanding cumulative radiation exposure over multi-year mission durations. It ensures reliable power delivery for critical satellite subsystems throughout the spacecraft's operational lifetime. The design addresses the growing demand for compact, efficient power management solutions in commercial and defense satellites operating at higher altitudes where radiation levels significantly exceed LEO conditions. This achievement expands our portfolio of space-qualified power solutions and demonstrates our capability to develop complete power systems from component selection through environmental qualification testing. The successful qualification positions us to support next-generation satellite constellations, geostationary communications platforms, and emerging cislunar exploration missions requiring robust, long-duration power electronics.

Sintering Paste Technology

Sub-Link Work 

Sub-link is a solution for high-aspect-ratio PCBs where subsections are electrically connected in the z-axis using a conductive sintering paste. In 2025, we dedicated multiple resources and capital to growing, improving, and developing the use of sintering paste technology. Equipment was purchased to standardize processing across multiple sites and the eventual implementation in the upcoming Syracuse Expansion facility. A team has been formed among engineers with decades of sintering paste experience and emerging engineering talent to share and learn best practices. 

Mission Systems

OpenVPX/SOSA Chassis

Our Mission Systems team completed the build of a new rugged, High Performance Embedded Computer ("HPEC") designed in accordance with the requirements of VITA65 and aligned with the Sensor Open System Architecture ("SOSA") standard. The product was designed from the ground up and can be configured with firmware and software to meet the need of a low-cost Size, Weight and Power ("SWAP") HPEC for multiple new strategic products. The HPEC form factor is a standard ¾ ATR chassis. Power input is 270 VDC and the power converter supports payload cards up to 800 Watts. Payload cards consist of Multiprocessor System-On-Chip ("MPSOC"), Digital Signal Processors ("DSP"), Signal Board Computers ("SBC"), and a General Purpose Graphics Processing Unit ("GPGPU") connected by a 40 Gb/s Data Plane and 1000 Base T Control Plane. All cards are COTS 3U form factor and conduction cooled. Front Panel I/O includes power input, industry stand and fiber-optic interfaces.

SMARTCAP 2025

Our Communication Systems engineering team successfully released all sub-assemblies for the SmartCAP, our next-generation Intercommunication System ("ICS") solution, for initial prototype fabrication. SmartCap is a single-box ICS solution that combines operator interfaces (panels) and radio interfaces in a single Line Replaceable Unit ("LRU"). It reduces the SWAP of previous ICS solutions on the aircraft and provides higher audio bandwidth and other advanced features. Hardware deliveries for integration are expected in early 2026.

These projects are a mere snapshot of how our engineering excellence translates into real-world impact. Our engineers continue to thrive where precision meets innovation—delivering solutions built to perform when it matters most. 

With strong momentum behind us, we’re energized by the opportunities ahead and excited to see what our 2026 projects will bring to the future of technology.