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Seminars & Webinars

December 6 , 2017

"PCB Emerging Products - ICT and Smart Phone

Shenzhen Convention & Exhibition Center,
Shenzhen, China"

This presentation not only gives an insight to current PCB fabrication technologies and material solutions. Development needs required to meet next gen PCB manufacturing challenges will also be discussed.

December 6 - 8, 2017

5G Challenges For PCB Fabrication

Shenzhen Convention & Exhibition Center,
Shenzhen, China

Ready for 5G? It is time to understand how will 5G requirements challenge PCB Fabrication.

This presentation will share:
  • TTM’s understanding of 5G
  • PCB design trend driven by 5G and the challenges
  • Our readiness for 5G PCB design requirements (fine feature optimization, thermal solutions, asymmetric structure, advance material & signal Integrity).

Rigid-flex Technology and Applications

Shenzhen Convention & Exhibition Center,
Shenzhen, China

Introducing Rigid-Flex Technology & Applications

PCB Design Best Practices For Automotive

Shenzhen Convention & Exhibition Center,
Shenzhen, China

Want to save PCB project time and cost? Design high-reliability PCBs? All these are possible with the implementation of PCB design best practices. This presentation provides recommendations on designing PCBs and how to make them more cost effective.

Topics include:
  • Various technologies for automotive
  • Stack-up optimization
  • From proto to volume
  • Design guidelines, and
  • Common design errors

January 24 , 2017

PCB Bootcamp Webinar Series: PCB 101

February 21 , 2017

PCB Bootcamp Webinar Series: DFM

March 21 , 2017

PCB Bootcamp Series: RF / Microwave

April 18 , 2017

PCB Bootcamp Series: Thermal Management

May 23 , 2017

PCB Bootcamp Series: Rigid-Flex 101